Technical Terms

ICompany No. I747681-H I
DEFINITIONS (Cont’d)
CAM Computer-aided manufacturing
CNC Computer numerical control
CSP Chip scale package, a type of IC chip that has no pins or wires, but uses contact pads instead
DFT Design for tcst
DlMM Dual in-line memory module, a series of random accessed memory ICs mounted on a printed circuit board and usually used for personal computers
GHz Gigahertz
IC Integrated circuit, a miniaturised electronic circuit, which has been manufactured in the surface of a semiconductor material
MEMS Micro electro mechanical systems
MHz Megahertz
micron A unit of measurement for distance, denoting a millionth of a metre
MLF Micro leadless frame, a type of chip package whereby the leads or contact points are exposed on the bottom of the chip package
MLP Micro leadless package, a type of chip package whereby the leads or contact points arc exposed on the bottom of the chip package
mm Millimetre
om Nanometre
PCB Printed circuit board
PDA Personal digital assistants
QFN Quad flat no lead package, a type of chip package whereby the leads or contact points are exposed on the bottom of the chip package
QFP Quad flat package, a type of chip package, which has leads extending from each of the four sides. Various versions exist in this class of chips with slightly differing specifications such as tbe Low Profile QFP (“LQFP”), Plastic QFP (“PQFP”) and Thin QFP (“TQFP”)
RF Radio freq uency
SoC System on chip
SOP Small outline package, which is rectangular-shaped chip usually used as memory module. Similar variants with different dimensions and characteristics exist such as Shrink Small SOP (“SSOP”) or Thin Shrink Small SOP (“TSSOP”)
SOT Small outline transistor. which is a semiconductor device commonly used amplifier or an electrically controlled switch as an
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