Technical Terms

“Acquisitions” “Acquisitions” “Act” “ADA” “Application Form”
“ASEAI\I” “ATM” “Avago Malaysia”
“Avago Technologies”
“Avago” “Board” “Bursa Depository” “Bursa Securities”
“CAGR” “CCM” “CDS Account” “CDS” “Closing Date” “CMSA” Collectively, the acquisitions of the entire issued and paid-up share capital of Inari Technology and Simfoni by our Company, as further described in Section 5.3 of this Prospectus. Companies Act, 1965, as amended from time to time, and any re­enactments thereof Authorised Depository Agent The printed application form for the application of the IPa Shares accompanying this Prospectus The application for the IPa Shares by way of Application Form, Electronic Share Application or Internet Share Application The Association of Southeast Asian Nations Automated Teller Machine Avago Technologies (Malaysia) Sdn Bhd, a wholly-owned subsidiary of Avago Avago Technologies Trading Limited, a wholly-owned subsidiary of Avago Avago Technologies Limited Board of Directors of Inari Bursa Malaysia Depository Sdn Bhd Bursa Malaysia Securities Berhad Compounded annual growth rate Companies Commission of Malaysia An account established by Bursa Depository for a depositor for the recording of securities and for dealing in such securities by the depositor Central Depository System Means the date adopted in the Prospectus as the last date for· acceptance and receipt of application for the subscription to the IPa Shares or such other later date as the Company and the Underwriter may agree upon. Capital Markets & Services Act 2007, as amended from time to time, and any re-enactments thereof viii “Depository Rules” “Electronic Share Application” “EPS” “EQUINITI” “FPE 2007” “FPE 2010” “FPE 2011” “FYE” “IMR” or “D&B Malaysia” “Inari Group” or “Group” “Inari Technology Vendors” “Inari Technology” “Inari” or “Company” “Insas Technology” “Internet Share Application” “Internet Participating Financial Institutions” “IPO Price” RM10,OOO,OOO oWing by Simfoni to Insas Technology settled/to be settled in the following manner:
(i) RM2,450,OOO settled on 21 September 2010 via the allotment of 7,000,000 Shares to Insas Technology by Inari at the issue price of RMO.35 per share; and
(ii) RM7,550,OOO to be settled via proceeds from the Public Issue or borrowings to be secured by our Group.

Further details of the Debt Settlement are set out in Section 5.3.2 herein. The Rules of Bursa Depository and any appendices thereto as they may be amended from time to time Application for the IPO Shares through a Participating Financial Institution’s ATM Earnings per share Equiniti Services Sdn Bhd (formerly known as MIDF Consultancy and Corporate Services Sendirian Berhad) 13 months financial period from 1 June 2006 to 30 June 2007 Six (6) months financial period ended 31 December 2009 Six (6) months financial period ended 31 December 2010 Financial year(s) ended/ending 30 June, as the case may be Dun & Bradstreet (D&8) Malaysia Sdn Bhd, our Independent Market Researcher Inariand its wholly-owned subsidiary companies, Inari Technology and Simfoni The vendors of Inari Technology, namely Insas Technology, Macronion, Ho Phon Guan and Avago Malaysia Inari Technology Sdn Bhd, a wholly-owned subsidiary of Inari Inari Berhad Insas Technology Berhad, a wholly-owned subsidiary of Insas Berhad Application for the IPO Shares through an Internet Participating Financial Institutions The participating financial institutions for Internet Share Application as listed in Section 17 of this Prospectus The issue price of RMO.38 per Share pursuant to the Public Issue ix
“IT” “Latest Practicable Date” or “LPD” “Listing Requirements” “Listing Scheme” “Listing”
“M&A securities” “Macronion” “Malaysian Public”
“MIDA” “Mm” “MNCs” “NA” “NBV” “NTA”
“Participating Financial Institution(s)” “PAT” “PBT” “PE Multiple” “Pink Form Allocations”
“Plant 1”

Qur initial public offering comprising the Public Issue Information technology 3 June 2011, being the latest practicable date for ascertaining certain information contained in this Prospectus ACE Market Listing Requirements of Bursa Securities Comprising the Public Issue and Listing, collectively Listing of and quotation for our entire enlarged issued and paid-up share capital of 331,608,700 Shares on the ACE Market of Bursa Securities M&A Securities Sdn Bhd Macronion Sdn Bhd Malaysian citizens and companies, co-operatives, societies and institutions incorporated or organised under the laws of Malaysia Malaysian Industrial Development Authority Ministry of International Trade and Industry Multinational corporations Net assets Net book value Net tangible assets Participating financial institution(s) for Electronic Share Application Profit after taxation Profit before taxation Price-earnings multiple The allocation of 10,386,000 Shares to our eligible Directors, employees and persons who have contributed to the success of our Group pursuant to the IPQ Industrial premise comprising a 3-storey detached factory with guard house built on 2,089 sq m of leasehold land and a 4,047 sq m adjoined vacant leasehold land, owned by Inari Technology and situated at No.5, Hilir Sungai Keluang 3, Bayan Lepas Free Industrial Zone Phase 4, 11900 Bayan Lepas, Penang x “Plant 3”
“Plant 5” “Plant A” “Private Placement” “Promoters” “Public Issue Shares” or “IPO Shares” “Public Issue” “RCPS-A” A single storey factory building with built up area of 836 sq m leased by Inari Technology and situated at No 155-A, Bayan Lepas Free Industrial Zone Phase 1, 11900 Bayan Lepas, Penang. The lease agreement for Plant 2 was terminated on 30 June 2010
Industrial premise comprising a 3-storey detached factory-cum­office block with guard house built on 8,332 sq m of leasehold land, owned by Simfoni and situated at No. 51, Hilir Sungai Keluang 4, Bayan Lepas Free Industrial Zone Phase 4, 11900 Bayan Lepas, Penang A proposed industrial premise comprising a 3-storey building with a total built up area of 5,351 sq m to be erected within the compound of Plant 3 Note: Since the termination of Plant 2, our management deCided to name the production / manufacturing plants in odd sequence numbers, i.e. Plant 1, Plant 3 and Plant 5 Industrial premise comprising a single storey warehouse/ manufacturing facility leased by Inari Technology with a built up area of 3,623 sq m situated at No 17, Jalan Kampung Jawa, Kawasan Perindustrian Bayan Lepas, Fasa 3, 11900 Bayan Lepas, Penang. The lease agreement was entered into on 6 December 2010 and is effective for a period of three (3) years commencing 1 December 2010 Issuance of 62,614,000 new Shares in conjunction with our IPO in the following manner: (i) 26,154,000 new Shares by way of private placement to identified investors; and
(ii) 36,460,000 new Shares by way of private placement to identified Bumiputera investors approved by Mm

Comprising collectively, Insas Technology, Macronion and Ho Phon Guan 83,000,000 new Shares to be made available for application pursuant to the Public Issue, subject to the terms and conditions of this Prospectus Public issue of 83,000,000 new Shares at the IPO Price payable in full upon application subject to the terms and conditions of this Prospectus Redeemable convertible preference shares in Inari Technology (Class A) subscribed by Avago Malaysia which were converted into ordinary shares of RM1.00 each in Inari Technology on 5 August 2010 xi “RM” and “sen” “SC” “Share(s)” or “Inari
Share(s)” “SICDA” or “Depository Act” “Simfoni” “South Korea” “sq m” “sq ft” “Underwriter” “Underwriting Agreement”
“USA” or “US” “USD”


Technical Glossary “Bluetooth” “Box-Build” “Class 10K cleanroom” “Class lOOK cleanroom” “COB” Redeemable convertible preference shares in Inari Technology (Class H) subscribed by Ho Phon Guan which were converted into ordinary shares of RM1.00 each in Inari Technology on 5 August 2010 Ringgit Malaysia and sen respectively Securities Commission Malaysia Ordinary shares of RMO.l0 each in Inari Securities Industry (Central Depositories) Act, 1991, as amended from time to time, and any re-enactments thereof Simfoni Bistari Sdn Bhd Republic of Korea Square meters Square feet M&A Securities, our underwriter The underwriting agreement dated 3 June 2011 entered into between Inari and M&A Securities pursuant to the IPO United States of America United States Dollars An open wireless technology standard for exchanging data over short distances (using short wavelength radio transmissions) from fixed and mobile devices An assembly/manufacturing process for the production of end­use electronic devices Clean room controlled with quantity of sizes of 0.5 IJm particles shall not exceed 10,000 count in flow rate of 0.1 feet3 / minute per testing point Clean room controlled with quantity of sizes of 0.5 IJm particles shall not exceed 100,000 count in flow rate of 0.1 feet3 / minute per testing point Chip-on-Board. A semiconductor assembly process wherein the microchip or die is directly mounted on and electrically interconnected to its final circuit board xii “EMS”
“ESD” “GPS” “HSDPA” “IC” “in” “ISO” “Kanban” “LED” “MCOB” “mil” “mm” “NPI” “ODM” “OEM” “PCB” “PCBA” “PDA” “Poka-yoke'” Direct current, an electric current that flows in one direction
steadily Electronic Manufacturing Services, a term used for companies that design, test, manufacture, distribute and provide other services for electronic component assembly Electrostatic discharge, an electric current, such as a spark that is
triggered when the potential difference a threshold value Global positioning system, a space-based global navigation satellite system that provides reliable location and time information High-Speed Downlink Packet Access, an enhanced 3G (third generation) mobile telephony communications protocol Integrated Circuit, a miniaturised electronic circuit that has been manufactured in the surface of a thin substrate of semiconductor material Inch International Organisation for Standardisation A production concept related to lean and just-in-time production. Light emitting diode, a semiconductor light source Multiple-Chip-on-Board. A semiconductor assembly process wherein multiple microchips or dies are directly mounted on and electrically interconnected to its final circuit board thousandth of an inch millimetres New product introduction Original design manufacturer Original equipment manufacturer Printed circuit board, used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate Printed circuit board assembly Personal digital assistant, a mobile device which functions as a personal information manager A Japanese term that means “fail-safe” or “mistake-proofing”. xiii
“PVC”  Polyvinyl Chloride, a thermoplastic polymer  “QA”  Quality Assurance  “QC”  Quality Control  “QFN”  Quad Flat No-Lead, a packaging electrically connect ICs to PCBs  method  to  physically  and  “QMS”  Quality management system  “R&D”  Research and development  “RF”  Radio Frequency, an audio and infrared  electromagnetic  wave  frequency between  “SiP”  System in Package. A package or module that has number of ICs enclosed in  “SIIIIT”  Surface Mount Technology. A method for constructing electronic circuits in which the components are mounted directly onto the surface of PCBs  “TAP”  Technical advisory panel  “um”  Micrometer  “WiFi”  Wireless Fidelity. A trademark of the Wi-Fi Alliance that manufacturers may use to brand certified products that belong to a class of wireless local area network devices based on the IEEE (Institute of Electrical and Electronics Engineers) 802.11 standards  [ The rest ofthis page is intentionally lett blankJ


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